Hardware footprint

XBee modules come in three hardware footprints: through-hole, surface mount, and micro mount.

• Through-hole technology (THT) XBee modules include the 20-pin socket and require holes for mounting the component on the printed circuit board (PCB), although it is common for the carrier board to contain a female socket.
• Surface-mount technology (SMT) XBees include 37 pads. They are placed directly on the PCB, which means they do not require holes or sockets for mounting the component.

• Micro-mount technology (MMT) XBees include 34 pads. They are placed directly on the PCB, which means they do not require holes or sockets for mounting the component.

  

Through-hole technology is typically used in prototyping and production. MMT/SMT is recommended for high-volume applications, as the component can be placed automatically by a pick-and-place machine and you save the cost of a socket on each board.

Note Not all XBees are available in all form factors.