Recommended solder reflow cycle

The following table lists the recommended solder reflow cycle. The chart shows the temperature setting and the time to reach the temperature.

Time (seconds)	Temperature (°C)
30	65
60	100
90	135
120	160
150	195
180	240
210	260

The maximum temperature should not exceed 260 °C.

The device reflows during this cycle, and must not be reflowed upside down. Be careful not to jar the device while the solder is molten, as parts inside the device can be removed from their required locations.

Hand soldering is possible and should be done in accordance with approved standards.